pp金银岛The Hestia offers exceptional treatment uniformity with throughput and low risk, enabled by a compact vacuum chamber design and a fully automated material handing system.
pp金银岛• Pre-wire bonding: Removal of metal oxides to ensure good bond strengths and yields.
pp金银岛• Pre-molding: Enhance surface energy to improve material adhesion and eliminate defects such as delamination and voids.
pp金银岛• Pre-underfill: Improve fluidity of underfill encapsulants and reduce voids.
pp金银岛• Descumming: Removal of residue photoresist from wafers.
pp金银岛• Surface roughening and etching: reduce surface stress for better surface adhesion.
pp金银岛• High efficiency compact vacuum chamber offers exceptional treatment uniformity.
pp金银岛• Strips are transferred from magazines to an intermediate loading tray before entering the chamber, reducing the risk of interruption caused by strip misalignment.
pp金银岛• PLC and IPC combination provides stringent process control with an intuitive graphical interface and real-time process representation.
pp金银岛• Engineered for maximum reliability and durability while offering easy access for maintenance.
|Enclosure||WxDxH||2020W*1250D*1610H mm( 含灯塔高2015mm)|
|Electrodes||Max Number||334W x 432Dmm|
|PF System||RF Power&Frequency||600W/13.56MHz|
|Gas Control||Number of MFCs||2 standard/ up to 4|
|Vacuum Pump||Pump||80m³/h Dry Pump|
|Dry Pump Purge N2 Flow||5-25L/min|
|Facility Reauirements||Power Supply||380V，25A，50Hz，3-Phase，5-Wire|
|Process Gas Fitting Size&Type||0.25 in.OD|
|Process Gas Purity|
CF4 = 99.97%; O2 = 99.996%; N2 = 99.99%;
Ar = 99.999%; Consult the heLijiating for the rest of the gas
|Process Gas Pressure||15-30 psig|
|Purge Gas Fitting Size&Type||0.25 in.OD|
|Purge Gas Purity||N2=99.99%|
|Purge Gas Pressure||15-30 psig|
|Pneumatic Valves Fitting Size&Type||外径8mm PU软管|
|Pneumatic Gas Specifications||CDA、60-90 psig|
|Exhaust Size & Type||KF40|
|Working Temperature||15-30 ℃|